Applications：

widely used in Electronic components packaging,Optical apparatus,Sensitive components,Various types of vacuum packaging,  IC / Integrated / board,Semiconductor packaging and testing,LED package, IC package, Computer equipment industry,biochips ect.

Production standard:

* 2004/73 / EC (EU environmental regulations)

* GJB2494-95 (People's Republic of China Military Standard)

* MIL-I-8835A (US military packaging standards)

* JEDEC (Electronic Components Industry Association Standard)

Specifications:

      5～10～15％，5～10～60％ ，30～40～50% ，10～20～30～40% ，10～20～30～40～50～60％ and can be specified according to the specific needs of customers customized production.

Packaging and storage:

Precautions:

*Please replace the desiccant package later turned three times.

* Keep in a dry, cool place, away from direct sunlight and flooding.